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surface mount device造句

"surface mount device"是什么意思   

例句與造句

  1. Solderability tests for surface mounted devices
    表面組裝元器件可焊性試驗
  2. Smd : surface mount device
    表面安裝設(shè)備
  3. Preconditioning of nonhermetic surface mount devices prior to reliability testing
    可靠性試驗之前不密閉表面安裝設(shè)備的預(yù)調(diào)節(jié)
  4. Handling , packing , shipping and use of moisture reflow sensitive surface mount devices
    對潮氣回流敏感的表面安裝器械的搬運(yùn)包裝運(yùn)輸和使用
  5. Smd . surface mounting technology - transportation and storage conditions of surface mounting devices - application guide
    地面安裝工藝.地面安裝設(shè)備
  6. It's difficult to find surface mount device in a sentence. 用surface mount device造句挺難的
  7. Semiconductor discrete device dimensions of outline and lead - frame for the surface mounting device
    半導(dǎo)體分立器件表面安裝器件外形尺寸及其引線框架尺寸
  8. Standard for handling , packing , shipping and use of moisture reflow sensitive surface mount devices
    表面安裝的濕度反流敏感設(shè)備的搬運(yùn)包裝船運(yùn)和使用標(biāo)準(zhǔn)
  9. Printed wiring boards - guide for the design and use of printed wiring boards : surface mounted devices
    印制電路板.第23部分:設(shè)計和使用導(dǎo)則:表面安裝器件規(guī)范
  10. Smd . surface mounting technology - part 2 : transportation and storage conditions of surface mounting devices - application guide
    表面安裝技術(shù).第2部分:表面安裝裝置
  11. Smd . en 61760 - 2 surface mounting technology . part 2 : transportation and storage conditions of surface mounting devices . application guide
    表面安裝技術(shù).第2部分:表面安裝裝置
  12. Surface mounting technology part 2 : transportation and storage conditions of surface mounting devices - application guide
    表面安裝技術(shù)第2部分:表面安裝元器件的運(yùn)輸和貯存條件-應(yīng)用指南
  13. Smd environmental testing : tests - test : test methods for solderability of surface mounting devices by wetting balance using lead - free solder paste
    環(huán)境試驗:試驗.試驗:用無鉛焊錫膏濕潤平衡法測定表面安裝裝置
  14. Semiconductor devices - mechanical and climatic test methods - part 30 : preconditioning of non - hermetic surface mount devices prior to reliability testing
    半導(dǎo)體器件.機(jī)械和氣候試驗方法.第30部分:可靠性試驗之前不氣密的表面安裝器件的預(yù)調(diào)試
  15. Semiconductor devices - mechanical and climatic test methods - part 30 : preconditioning of non - hermetic surface mount devices prior to reliability testing
    半導(dǎo)體器件.機(jī)械和氣候試驗方法.第30部分:可靠性試驗之前不氣密的表面安裝器件的預(yù)調(diào)試
  16. 更多例句:  下一頁

相鄰詞匯

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